Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film

Journal
Journal of the Chinese Institute of Engineers
Journal Volume
40
Journal Issue
8
Start Page
669-677
ISSN
0253-3839
2158-7299
Date Issued
2017-10-20
Author(s)
Lung-Chuan Tsao
Jun-You Chen
DOI
URI
Publisher
Informa UK Limited
Type
journal-article