Preparation of hydrophobic nylon 6-phenol resin derivative polymer blends for the dielectric application and theoretical evaluation of their hydrophobic property

Developing a polymer dielectric material is always a demand in the polymer industry especially in the electronic industry for the application of microelectronic device designing. In this paper, hydrophobic nylon6-phenol resin derivative polymer blends was prepared by Mannich reaction to evaluate their dielectric property. The obtained product was characterized by FTIR, XRD, TGA and were screened for the hydrophobic, mechanical, dielectric properties. FTIR spectra confirm the hydrogen bonding interaction in the polymer blends. The decomposition temperature of above 400 °C for the prepared polymer blends shows good thermal stability. The water contact angle study shows an increased hydrophobic (i.e., near hydrophobic) nature of the polymer blends compared to nylon 6 and it was also confirmed by the theoretical study. The compressive stress and strain study shows the polymer blends have a good mechanical properties with the decreased brittle nature of phenol resin. The frequency depended on the dielectric property and was taken at room temperature in 1 MHz frequency showing high dielectric constant and loss. Thus, this thermally stable, hydrophobic, dielectric polymer could be used as a potential material for application of microelectronic device designing.