低危害性製程開發：碳化矽強化材無電鍍銅膜提升Cu/(SiC)p金屬基複合材料之接合及耐腐蝕性

金屬基複合材料(MMC)具有優異之機械性質，如耐高溫、耐腐蝕、耐磨耗和高強度，已成為航空、汽車、國防、海洋工業的首選材料，但金屬基複合材料的機械性質很大程度受金屬基材與強化材間的結構與性能影響，若兩材料間濕潤性不佳，易產生強化材團聚、分布不均的問題，導致材料強度下降，傳統金屬基複合材料主要以液相製程為主，需將金屬加熱至熔融狀態，在接合過程中也易產生偏析與介金屬化合物等缺陷，使材料之接合品質下降，為解決此問題的發生，本實驗擬以透過無電鍍技術及固態擴散接合製程，增加強化材與金屬基材間的潤濕性及分散性，並提高接合性能，而為了解強化材經無電鍍銅膜處理後，是否能提升其耐腐蝕能力，故將試片置於1 M HCl腐蝕液中，觀察試片經不同腐蝕時間後的金相微結構與破斷面，及量測腐蝕後試片的剪切強度。實驗結果顯示未經無電鍍銅膜碳化矽之Cu/(SiC)p試片，強化材團聚現象較為嚴重，試片內部的界面接合強度不佳，導致剪切強度較弱；而當碳化矽強化材經無電鍍處理後，在無需外加銅粉的情況下，由於碳化矽均以銅膜接觸，提升試片界面接合的強度，故其剪切強度最高。在耐腐蝕性試驗中，由於碳化矽經無電鍍銅處理後，能改善強化材團聚的現象，導致試片內部的孔洞減少，使腐蝕液較不容易滲入試片內部，故碳化矽經無電鍍處理後，在無須外加銅粉的情況下，其耐腐蝕性能最好。此研究結果不僅證明無電鍍銅膜能夠有效提升金屬基複合材料之剪切強度及其耐腐蝕性質，也成功利用危害較低的熱壓接合製程降低取代傳統銲接製程，避免在焊接過程中產生的高溫、強光、金屬燻煙等危害因子，降低勞工暴露於危害風險中的機率。

Metal matrix composites (MMC) possess excellent mechanical properties such as high temperature resistance, corrosion resistance, wear resistance, and high strength, making them the material of choice in aerospace, automotive, defense, and marine industries. However, the mechanical properties of MMC are influenced by the structure and performance of the metal matrix and the reinforcing materials. A poor wettability between the two materials can lead to agglomeration and uneven distribution of the reinforcing materials, reducing the strength of the composite. The traditional MMCs are primarily produced using a fusion process, requiring the metal to be heated to a molten state. This process can lead to segregation and the formation of intermetallic compounds, which degrade the bonding quality of the materials. To address these issues, this experiment aims to use electroless plating technology to enhance the wettability and dispersibility between the reinforcing materials and the metal matrix, and to improve the bonding performance of Cu/(SiC)p MMCs. To understand whether the reinforcing materials deposited with a copper film could enhance their corrosion resistance, the specimen were immersed in a 1 M HCl. The microstructure and fracture surfaces of the specimen was examined after various corrosion durations, and the shear strength of the corroded specimen was obtained. The experimental results showed that untreated Cu/(SiC)p specimen exhibited severe agglomeration and weak interfacial bonding strength, resulting in lower shear strength. Conversely, when the SiC deposited with Cu film using electroless plating, improving the interfacial bonding strength of the specimen and then the shear strength was improved. In the corrosion resistance tests, SiC was deposited with electroless copper, the SiC agglomeration was reduced, improving the density of Cu/(SiC)p MMCs and the corrosive solution penetrating the specimen was difficult. The corrosion resistance of Cu/(SiC)p MMCs was thus improved for the SiC deposited with Cu film. These experiment results demonstrate that SiC electroless plating copper film can effectively enhance the banding performance and corrosion resistance of Cu/(SiC)p MMCs. Additionally, it successfully uses a lower hazard hot pressing process to replace traditional welding, avoiding hazards such as high temperatures, intense light, and metal fumes generated during the welding process, thereby reducing the possibility of worker exposure to risks.