Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film

Lung-Chuan TsaoYen-Hui LinCheng-Li ChuangJun-You Chen2026-01-282026-01-282017-10-2010.1080/02533839.2017.1384329https://scholars.csmu.edu.tw/handle/123456789/3087Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive filmjournal-article