2026-08-252026-08-25https://scholars.csmu.edu.tw/handle/123456789/16875The plasma surface activated bonding (SAB) technique was applied in flip chip bonding of chips and substrates. An argon gas was selected to perform the physical plasma treatment on the bonding sur...(詳)本研究以表面電漿活化接合(surface activated bonding, SAB)技術運用於金凸塊與銅電極之覆晶接合製程，此活化技術選用物理性氬氣電漿對接合材料表面進行活化處理，期以電漿...(詳)電漿活化接合熱壓覆晶接合金凸塊銅電極argon plasma activationthermal compression bondingcopper electrodegold bump.research project