2026-09-302026-09-30https://scholars.csmu.edu.tw/handle/123456789/19558This study was expected to verify reliability of chips and flex substrates assembly by argon plasma activation and to establish failure mechanisms for specimens subjected to various reliability te...(詳)本研究主要以氬氣電漿活化處理晶片凸塊及軟性基板表面，提升晶片以非導電膠熱壓覆晶接合於軟性基板之強度，並將接合後之試片依美國電子元件工程聯合會(JEDEC)之可靠度測試規範，進行高溫儲存(hig...(詳)非導電膠氬氣電漿活化高溫儲存試驗高壓蒸煮試驗恆溫恆濕試驗NCPargon plasma activationHTS testPCTHTHH testProject