2026-08-252026-08-25https://scholars.csmu.edu.tw/handle/123456789/17060Argon plasma was selected to perform the surface activation on the surface of flex substrates in this study. This argon plasma activation technology was expected to remove the surface contaminants...(詳)本研究結合熱壓接合製程與非導電膠(non-conductive paste, NCP)將晶片覆晶接合於軟性基板，藉由軟性基板與晶片凸塊表面進行物理性之氬氣電漿活化處理，期望提升晶片與軟性基板之...(詳)非導電膠覆晶接合電漿活化技術Non-conductive pasteflip-chip bondingplasma activated technologyresearch project