2026-08-252026-08-25https://scholars.csmu.edu.tw/handle/123456789/17061A non-conductive film (NCF) and the thermal compression bonding process were combined to assemble the chips and flex substrates. To achieve the gold bumps of chips bonded on copper electrodes of f...(詳)本研究以非導電膜(non-conductive film)結合熱壓覆晶接合製程將植金凸塊之晶片接合於軟性基板銅電極，接合過程中以不同接合溫度、固化溫度與固化時間探討晶片與軟性基板之接合強度。為...(詳)熱壓覆晶接合非導電膜電漿活化non-conductive filmthermal compression bondingplasma activationresearch project