YEN-HUI LINCHENG-LI CHUANG2026-10-162026-10-162017-11-17Pure ID: 14961205Pure UUID: 977a1c72-5f35-4993-a86f-b759dde61b4d10.1080/02533839.2017.1384329https://www.scopus.com/pages/publications/85031799764https://scholars.csmu.edu.tw/handle/123456789/34463A non-conductive film (NCF) and a thermal compression process were combined to assemble a chip onto a flexible substrate. To achieve direct bonding and to enhance the adhesion of a chip on the flexible substrate with NCF, argon plasma was used to clean copper electrodes over a flexible substrate. For flexible substrates which received argon plasma cleaning, low contact angles were obtained, and gold bumps directly contacted copper electrodes to form active input/output (I/O) paths, indicating the contaminants on the flexible substrate were removed and a clean bonding surface could be achieved. Neither delamination nor porosity was observed at the bonding interface between the NCF and copper electrodes. A sound bonding interface with satisfactory die-shear force was achieved. The argon plasma cleaning led to a significant improvement of the die-shear force of a chip bonded onto the flexible substrate using NCF.9enjournal article